The process special gas used in the TFT-LCD manufacturing process CVD deposition process: silane (S1H4), ammonia (NH3), phosphorne (pH3), laughter (N2O), NF3, etc., and in addition to the process process High purity hydrogen and high purity nitrogen and other large gases. Argon gas is used in the sputtering process, and the sputtering film gas is the main material of sputtering. First, the film forming gas cannot be chemically reacted with the target, and the most suitable gas is an inert gas. A large amount of special gas will also be used in the etching process, and the electronic special gas is mostly flammable and explosive, and the highly toxic gas, so the requirements for the gas path are high. Wofly Technology specializes in the design and installation of ultra high purity transportationsystems.
Special gases are mainly used in the LCD industry to film forming and drying processes. The liquid crystal display has a wide variety of classification, where the TFT-LCD is fast, the imaging quality is high, and the cost is gradually reduced, and the most widely used LCD technology is currently used. The manufacturing process of the TFT-LCD panel can be divided into three major phases: the front array, medium-oriented boxing process (CELL), and a post-stage module assembly process. The electronic special gas is mainly applied to the film formation and drying stage of the previous array process, and a SiNX non-metal film and a gate, source, drain and ITO are deposited, respectively, and a metal film such as a gate, source,drainandITO.
Nitrogen / Oxygen / Argon Stainless Steel 316 Semi-Automatic Changeover Gas Conrol Panel
Post time: Jan-13-2022